Preparation of RPSL-01 Type photosensitive resin for Stereo lithography and study on its some properties
Huang, B; Weng, Z; Lu, S; Chen, W
| HERO ID | 2232056 |
|---|---|
| In Press | No |
| Year | 2011 |
| Title | Preparation of RPSL-01 Type photosensitive resin for Stereo lithography and study on its some properties |
| Authors | Huang, B; Weng, Z; Lu, S; Chen, W |
| Journal | Advanced Materials Research |
| Volume | 287-290 |
| Page Numbers | 386-389 |
| Abstract | RPSL-01 type photosensitive resin for Stereo lithography was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), tripropylene glycol diacrylate (TPGDA), pentaerythritol triacrylate(PETA), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30 degrees C was 425mP(a).S, The glass transition temperature (Tg) of the UV-cured specimen was 47 degrees C, and the weight loss of the UV-cured specimen at 200 degrees C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR). |
| Doi | 10.4028/www.scientific.net/AMR.287-290.386 |
| Wosid | WOS:000302894000084 |
| Is Certified Translation | No |
| Dupe Override | No |
| Is Public | Yes |
| Keyword | Stereolithography; photosensitive resin; laser; property |